Wintec Co., Ltd. provides x-ray, microchip, film and FPD, and artificial intelligence products. It offers WVS-6CX.AI, a device that inspects the external condition of microchips at high speed using proprietary algorithms and AI; WVS-RP3000, a device that inspects the condition of micro chips and reel tapes packed in reels at high speed; WVS-AM100CIB, a device that measures the electrical characteristics of microchips; WVS-MT300, a device that precisely mounts microchips on a PCB and board using pick and placement; WVF-CUxxx Series, a device that automatically inspects copper foil films; WXI-CT160, a device that inspect the product for defects through non-destructive inspection using nano focus X-ray; WXI-CT130, a device that inspect the product for defects through non-destructive inspection using micro focus X-ray; COF Insp. System, a COF PKG visual inspection system; WVS-AKKON, a device that inspects the conductive particles of the LCD and OLED Panel; and WVS-BONDER, a device that inspects the bonding status of the LCD & OLED Panel and Driver IC. The company was founded in 1999 and is based in Gunpo, South Korea.