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Yamaha Motor Robotics Holdings Co., Ltd., through its subsidiaries, engages in the development, manufacture, sale, and maintenance of semiconductor equipment and electronic component mounting equipment in Japan and internationally. Its products include bonding equipment, molding equipment, lead frames, lead processing machines, lead processing molds, and FA equipment; die, wire, flip chip, and bump bonders; and resin sealing devices, transfer devices, cutting molding equipment, and precision molds. The company also offers crystal device manufacturing equipment, such as mounting machines, temperature testers, drying ovens, etc.; camera module manufacturing equipment; flip chip bonder related products; FPD related mounting machines; LED chip inspection devices; MEMS, solar cells, secondary batteries, various automatic machines, and labor-saving equipment; and printed circuit board mounting CAM software. It serves manufacturers of electronics, crystal oscillators, camera modules, automotive equipment, and LCD parts. Yamaha Motor Robotics Holdings Co., Ltd. was formerly known as Shinkawa Ltd. and changed its name to Yamaha Motor Robotics Holdings Co., Ltd. in July 2019. The company was founded in 1959 and is headquartered in Tokyo, Japan. Yamaha Motor Robotics Holdings Co., Ltd. operates as a subsidiary of Yamaha Motor Co., Ltd.
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