Unisem (M) Berhad, together with its subsidiaries, provides semiconductor assembly and test services in Asia, Europe, and the United States. The company offers packaging and leadframe packaging services including advanced integrated circuit packaging technology, such as wafer bump, redistribution layer design and fabrication, flip chip interconnect, and wafer level chip scale packaging, as well as a range of leadframe and substrate integrated circuit packages. It also provides test services comprising wafer probe and final testing on test equipment covering test platforms, such as radio frequency, analog, digital, and mixed-signal; and test related services comprising reliability testing, thermal and electrical characterisation, dry pack, and tape and reel. In addition, the company offers turnkey services, including design, assembly, test, failure analysis, warehousing, and drop-ship services. Further, it engages in the marketing and other support services. The company serves its products to the fabless companies and integrated device manufacturers. The company was incorporated in 1989 and is headquartered in Kuala Lumpur, Malaysia.
तुलना करने के लिए मीट्रिक्स | UNSM | क्षेत्र सेक्टर - संबंधित क्षेत्र की कंपनियों के व्यापक समूह से मेट्रिक्स का औसत टेक्नोलॉजी | संबंध संबंधUNSMपीअर्सक्षेत्र | |
---|---|---|---|---|
पी/ई अनुपात | 70.5x | 33.5x | 11.2x | |
PEG अनुपात | −1.26 | −0.89 | 0.01 | |
क़ीमत/बुक | 2.2x | 1.8x | 2.4x | |
क़ीमत / एलटीएम बिक्री | 3.5x | 3.1x | 2.0x | |
अपसाइड (विश्लेषक लक्ष्य) | 15.6% | 40.3% | 35.3% | |
उचित मूल्य अपसाइड | अनलॉक करें | −0.4% | 7.5% | अनलॉक करें |