Unisem (M) Berhad, together with its subsidiaries, provides semiconductor assembly and test services in Asia, Europe, and the United States. The company offers packaging and leadframe packaging services including advanced integrated circuit packaging technology, such as wafer bump, redistribution layer design and fabrication, flip chip interconnect, and wafer level chip scale packaging, as well as a range of leadframe and substrate integrated circuit packages. It also provides test services comprising wafer probe and final testing on test equipment covering test platforms, such as radio frequency, analog, digital, and mixed-signal; and test related services comprising reliability testing, thermal and electrical characterisation, dry pack, and tape and reel. In addition, the company offers turnkey services, including design, assembly, test, failure analysis, warehousing, and drop-ship services. Further, it engages in the marketing and other support services. The company serves its products to the fabless companies and integrated device manufacturers. The company was incorporated in 1989 and is headquartered in Kuala Lumpur, Malaysia.