Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and Mainland China. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning,dicing, and tape-and-reel processes, as well as chip-on-film, chip on glass, chip-on-plastic, packaging attachment, and wafer level chip scale packaging services. It also provides compound semiconductors including SiGe, GaAs, GaN, SiC, and other wafers; flexible tape-and-reel circuit substrate; and chip tray. In addition, it develops, manufactures, packages, tests, sells, and after-sale services of integrated circuit and special materials for semiconductor; invests in, develops, manufactures, and sells electronic components; and manufactures and sale of elements. Chipbond Technology Corporation was incorporated in 1997 and is based in Hsinchu City, Taiwan.
तुलना करने के लिए मीट्रिक्स | 6147 | क्षेत्र सेक्टर - संबंधित क्षेत्र की कंपनियों के व्यापक समूह से मेट्रिक्स का औसत टेक्नोलॉजी | संबंध संबंध6147पीअर्सक्षेत्र | |
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पी/ई अनुपात | 13.8x | 55.0x | 11.3x | |
PEG अनुपात | −0.62 | 0.87 | 0.01 | |
क़ीमत/बुक | 1.1x | 2.2x | 2.4x | |
क़ीमत / एलटीएम बिक्री | 2.3x | 1.7x | 2.0x | |
अपसाइड (विश्लेषक लक्ष्य) | −2.0% | 30.6% | 25.2% | |
उचित मूल्य अपसाइड | अनलॉक करें | −0.5% | 6.3% | अनलॉक करें |