HANA Micron Inc. provides semiconductor back-end process packaging solutions in South Korea. The company offers packaging products, such as flip chips, laminated, lead frames, and wafer level packages; test solution that covers wafer test, package test, and module test; test platforms to serve various applications including SOC, RF, PMIC, Sensor, etc.; and test IT system that provide its customers a production management system, real-time process monitoring, data analysis system, and web reports, as well as electrical test and visual inspection. It also provides bumping solutions comprising various package solutions with wafer bumping such as WLCSP, FLIP CHIP, SiP, and FCQFN; and engineering solutions. The company was founded in 2001 and is headquartered in Asan-Si, South Korea.
तुलना करने के लिए मीट्रिक्स | 067310 | क्षेत्र सेक्टर - संबंधित क्षेत्र की कंपनियों के व्यापक समूह से मेट्रिक्स का औसत टेक्नोलॉजी | संबंध संबंध067310पीअर्सक्षेत्र | |
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पी/ई अनुपात | −11.4x | 8.7x | 11.6x | |
PEG अनुपात | 0.07 | 0.11 | 0.01 | |
क़ीमत/बुक | 1.8x | 1.2x | 2.4x | |
क़ीमत / एलटीएम बिक्री | 0.6x | 1.2x | 2.2x | |
अपसाइड (विश्लेषक लक्ष्य) | 53.6% | 48.9% | 23.1% | |
उचित मूल्य अपसाइड | अनलॉक करें | 24.4% | 3.9% | अनलॉक करें |