HANMI Semiconductor Co., Ltd. manufactures and sells semiconductor equipment in South Korea and internationally. The company offers vision placement equipment; flip chip, TSV dual stacking, TC, flip chip, jumbo panel flip chip, and die flip chip bonders; and EMI shield vision attach and detach, EMI shield vision placement, EMI shield tape mounter, EMI shield tape laser cutting, EMI shield tape demounter, vision inspection, and converlay attach equipment. It also provides power ECU auto, test handler, vision placement, trim, and form/singulation devices, as well as 3D vision inspection equipment; auto mold, compression auto mold, mechanical mold press, and hydraulic mold press equipment; laser marking, laser wafer marking, laser ablation, laser cutting, and laser cutting/deflash equipment. In addition, the company offers cam press trim and form, micro cam press, CSP singulation, pick and place, die soater, strip mounter, and test equipment. HANMI Semiconductor Co., Ltd. was founded in 1980 and is based in Incheon, South Korea.