Tong Hsing Electronic Industries, Ltd. manufactures and sells RF modules, metalized ceramic substrates, hybrid integrated circuits, and image sensors in Singapore, Malaysia, the United States, Hong Kong, China, and internationally. The company provides direct platted and bonded copper, active metal brazing, and thick film printed circuit substrate products; CMOS imaging products comprising wafer probing testing, wafer reconstruction, packaging, and image testing; and module packaging products, such as high frequency wireless communication modules and power semiconductors. It also offers customized module packaging and testing products, including hybrid integrated circuit modules and biomedical products; and develops and produces thick film substrates and customized semiconductor micro-module packaging products; and packaging services and substrate manufacturing technologies. The company’s products are used in IGBT, high-frequency switching power supply, automotive, aerospace, satellite communication, solar cell component, telecommunication power supply, laser system, high brightness and power LED, microwave, semiconductor equipment, computer peripheral components, medical and network equipment, image sensor, wireless communication, MEMS, and optoelectronic device applications. Tong Hsing Electronic Industries, Ltd. was incorporated in 1974 and is headquartered in Taoyuan, Taiwan.