Xintec Inc. operates as a wafer level chip scale packaging company in Asia, the United States, and Europe. It provides wafer level chip scale packaging for image and environmental sensors; wafer level post passivation interconnection for fingerprint and actuator sensors, micro-electromechanical components, power, analog, and RF components; and wafer testing services. The company also offers optical sensor chip scale packaging services comprising side-wall interconnect and through silicon via RDL interconnect products, various glass thickness and filters, and glass bonding to wafer with or without cavity; FSI/BSI/stack wafer reconstruction for mobile, automotive, and consumer applications; and specialty RW service with a glass lid for automotive applications. In addition, it provides micro-electromechanical systems sensor packaging services, such as wafer thinning and bonded wafer partial dicing to reveal bonding pad; CSP, using via last TSV to connect pad on wafer surface toward backside; and dry etching silicon to form large cavities to derive product performance needs; as well as 3D I/O redistribution, power ground enhancement, and dual side connection services. Xintec Inc. was incorporated in 1998 and is headquartered in Taoyuan City, Taiwan.
तुलना करने के लिए मीट्रिक्स | 3374 | क्षेत्र सेक्टर - संबंधित क्षेत्र की कंपनियों के व्यापक समूह से मेट्रिक्स का औसत टेक्नोलॉजी | संबंध संबंध3374पीअर्सक्षेत्र | |
|---|---|---|---|---|
पी/ई अनुपात | 35.3x | 62.9x | 12.3x | |
PEG अनुपात | −1.86 | 1.02 | 0.01 | |
क़ीमत/बुक | 4.9x | 3.6x | 2.4x | |
क़ीमत / एलटीएम बिक्री | 6.6x | 3.8x | 2.3x | |
अपसाइड (विश्लेषक लक्ष्य) | −0.1% | −13.1% | 24.4% | |
उचित मूल्य अपसाइड | अनलॉक करें | −2.4% | 4.9% | अनलॉक करें |