Xintec Inc. operates as a wafer level chip scale packaging company in Asia, the United States, and Europe. The company provides wafer level chip scale packaging, wafer-level back cover packaging, and testing services for semiconductors. It also offers optical sensor chip scale packaging services comprising side-wall interconnect and through silicon via XinTSV, various glass thickness and filters, and glass bonding to wafer with or without cavity; FSI/BSI/stack wafer reconstruction for mobile, automotive, and consumer applications; and specialty RW service with a glass lid for automotive applications. In addition, the company provides micro-electromechanical systems sensor packaging services, such as wafer thinning and bonded wafer partial dicing to reveal bonding pad; CSP, using via last TSV to connect pad on wafer surface toward backside; and dry etching silicon to form large cavities to derive product performance needs; as well as 3D I/O redistribution, power ground enhancement, and dual side connection services. Xintec Inc. was founded in 1987 and is headquartered in Taoyuan City, Taiwan.
तुलना करने के लिए मीट्रिक्स | 3374 | क्षेत्र सेक्टर - संबंधित क्षेत्र की कंपनियों के व्यापक समूह से मेट्रिक्स का औसत टेक्नोलॉजी | संबंध संबंध3374पीअर्सक्षेत्र | |
|---|---|---|---|---|
पी/ई अनुपात | 35.4x | 58.9x | 12.9x | |
PEG अनुपात | −1.87 | 1.90 | 0.01 | |
क़ीमत/बुक | 4.9x | 3.2x | 2.4x | |
क़ीमत / एलटीएम बिक्री | 6.6x | 3.3x | 2.4x | |
अपसाइड (विश्लेषक लक्ष्य) | 15.6% | −2.3% | 25.5% | |
उचित मूल्य अपसाइड | अनलॉक करें | −0.9% | 2.4% | अनलॉक करें |